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Skid Integrated PSA Nitrogen Generator 30 Nm3/H 99.999% Purity for Electronic Chip Packaging

Product Details

Place of Origin: Jiangsu, China

Brand Name: FLY SPEED

Certification: CE, ISO 9001:2015

Model Number: N2G-99.999

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 Set

Price: USD 15,000-45,000 / Set

Packaging Details: Export wooden case with PE film protection, sea-worthy packing

Delivery Time: 35-45 working days

Payment Terms: T/T,L/C

Supply Ability: 12 Sets per Month

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Highlight:

Chip Packaging N2 Generator

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Skid Integrated 99.999% System

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PLC Automatic 30 Nm3/H Gas Unit

Adsorbent:
Carbon Molecular Sieve (CMS)
Control System:
PLC + Touch Screen HMI
Capacity:
30 Nm3/H
Nitrogen Purity:
99.999% (O2 <= 5 Ppm)
Pressure Dew Point:
<= -60 Deg C
Air Source Pressure:
0.75 - 1.0 MPa
Adsorbent:
Carbon Molecular Sieve (CMS)
Control System:
PLC + Touch Screen HMI
Capacity:
30 Nm3/H
Nitrogen Purity:
99.999% (O2 <= 5 Ppm)
Pressure Dew Point:
<= -60 Deg C
Air Source Pressure:
0.75 - 1.0 MPa
Skid Integrated PSA Nitrogen Generator 30 Nm3/H 99.999% Purity for Electronic Chip Packaging
Skid Integrated N2G-99.999 Nitrogen Generator PLC Automatic 30 Nm3/H for Electronic Chip Packaging
The Skid Integrated N2G-99.999 Nitrogen Generator delivers 30 Nm3/H of 99.999% ultra-pure nitrogen for electronic chip packaging. Fully PLC-automated and skid-integrated, this industrial gas generator provides clean, moisture-free nitrogen for chip sealing, reflow soldering and component storage.
Product Attributes
Attribute Value
Brand Name Fly Speed
Model Number N2G-99.999
Capacity 30 Nm3/H
Nitrogen Purity 99.999% (O2 ≤ 5 ppm)
Integration Skid Integrated
HS CODE 8419609090
Core Features & Advantages
  • Ultra-High Purity 99.999%: Oxygen below 5 ppm protects chips from oxidation during packaging.
  • Skid Integrated Design: Generator, dryer, filters and controls pre-assembled on one skid.
  • PLC Automatic Operation: Fully automatic start, run and monitoring with touch screen HMI.
  • Electronic Chip Packaging: Ideal for chip sealing, reflow soldering and anti-oxidation storage.
  • Clean Dry Nitrogen: Dew point below -60°C prevents moisture damage to components.
  • Space Saving: Compact skid integration reduces installation footprint and cost.
Technical Specifications
Parameter Value
Nitrogen Capacity 30 Nm3/H
Nitrogen Purity 99.999% (O2 ≤ 5 ppm)
Pressure Dew Point ≤ -60°C
Air Source Pressure 0.75 - 1.0 MPa
Nitrogen Outlet Pressure 0.1 - 0.8 MPa (adjustable)
Voltage 220V / 380V, 50/60Hz
Adsorbent Carbon Molecular Sieve (CMS)
Control System PLC + Touch Screen HMI
Integration Full Skid Package
Applications
Used in electronic chip packaging lines, semiconductor component assembly, PCB reflow soldering and electronics cleanroom storage.
Frequently Asked Questions
Q: Why 99.999% purity for chip packaging?
A: Ultra-low oxygen and moisture prevent oxidation and contamination of sensitive electronic components.
Q: What is included in the skid package?
A: The skid integrates the PSA generator, purification dryer, filters and PLC control system.
Contact us today! Fly Speed supplies skid-integrated 99.999% nitrogen generators for electronic chip packaging.